specifications of any and all sanyo semiconductor co.,ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer ' s products or equipment. to verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. any and all sanyo semiconductor co.,ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. the products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. if you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage conditi on (temperature, operation time etc.) prior to the intended use. if there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. o2611 sy 20111014-s00006/o1211 sy 20110928-s00007 no.a1982-1/9 LV5683P overview the LV5683P is a multi voltage regulator suitable for usb silicon tuner car-audio systems. this ic has 4 outputs, v dd 5v(3.3v), audio(8.5v), swu(3.3v) and usb5v(cd 8v : available). about protection circuits, it has over-current-protection, over-voltage-protection and thermal-shut-down. v cc 1(swu and usb supply) is independent terminal from v cc , and accepts lower voltage(ex. fr om dc/dc converter) which enables to reduce power dissipation. features ? 4 system regulator v dd (lcd micon) : v out 5.0v(3.3v), i o max 300ma, reverse current prevention. audio : v out 8.5v, i o max 300ma swu(systems) : v out 3.3v, i o max 500ma usb : v out 5.0v(8.0v available for cd), i o max 1100ma ? over-current-protection ? ? thermal-shut-down typ 175oc ? specifications absolute maximum ratings at ta = 25 c parameter conditions conditions ratings unit supply voltage v cc max 36 v allowable power dissipation pd max (*ta 25 c) ic unit 1.3 w with al heatsink(50501.5mm 3 ) 5.3 w infinite heat rediation 26 w peak supply voltage v cc peak see below pulse wave. 50 v operating ambient temperature topr -40 to +85 c storage temperature tstg -55 to +150 c junction temperature tj max 150 c monolithic linear ic for car audio systems multi voltage regulator ic orderin g numbe r : ena1982a
LV5683P no.a1982-2/9 peak voltage testing pulse wave recommended operating condition at ta = 25 c parameter conditions ratings unit power supply voltage rating 1 v dd output(5v/3.3v) 7 to 16 v power supply voltage rating 2 usb(5v) output, swu output: v cc =v cc 1 7.5 to 16 v power supply voltage rating 3 audio output 10 to 16 v power supply voltage rating 4 usb(8v) output: v cc =v cc 1 10.5 to 16 v electrical characteristics at ta = 25c, v cc = v cc 1 =14.4v (*1) parameter symbol conditions ratings unit min typ max quiescent current i cc v dd no load, all en terminal = ? l ? 50 100 a audio_en input low input voltage v il 1 0 0.5 v high input voltage v ih 1 2.8 5.5 v input impedance r ih 1 280 400 520 k swu_en input low input voltage v il 2 0 0.5 v high input voltage v ih 2 2.8 5.5 v input impedance r ih 2 280 400 520 k usb_en input low input voltage v il 3 0 0.5 v high input voltage v ih 3 2.8 5.5 v input impedance r ih 3 280 400 520 k v dd (5v/3.3v)output(reverse current prevention diode implemented) v dd output voltage 1 v o 11 i o 11 = 200ma, ikv dd =open, or v dd out 4.75 5.0 5.25 v v dd output current 1 i o 11 v o 11 4.7v 300 ma v dd output voltage 2 v o 12 i o 12 = 200ma, ikv dd =gnd 3.13 3.3 3.47 v v dd output current 2 i o 12 v o 12 3.1v 300 ma line regulation v oln 1 7v < v cc < 16v, i o 1 = 200ma 50 100 mv load regulation v old 1 1ma < i o 11, i o 12 < 200ma 80 150 mv dropout voltage 1 v drop 1 i o 1 = 200ma (implemented diode) 1.5 2.5 v v cc ripple rejection r rej 1 f=120hz, v cc =1v pp , i o 1=200ma 40(*2) 50(*2) db v dd reverse current i rev v o 11=5.0v, v cc =0v 10 100 a usb/cd output ; usb_en = high usb output voltage 1 v o 21 i o 21 = 200ma, ikusb=open, or usbout 7.6 8.0 8.4 v usb output current 1 i o 21 v o 21 7.45v 1100 ma usb output voltage 2 v o 22 i o 22 = 1000ma, ikusb=gnd 4.75 5.0 5.25 v usb output current 2 i o 22 v o 22 4.6v 1100 ma line regulation v oln 2 10.5v < v cc 1 < 16v, i o 2 = 1000ma 50 100 mv load regulation v old 2 10ma < i o 21, i o 22 < 1000ma 100 200 mv dropout voltage 1 v drop 2 i o 21, i o 22 = 1000ma 1.0 2.0 v v cc 1 ripple rejection r rej 2 f=120hz, v cc 1=1v pp , i o 2=1000ma 40(*2) 50(*2) db continued on next page. 100msec 5msec 16v 50v 10% 90%
LV5683P no.a1982-3/9 continued from preceding page. parameter symbol conditions ratings unit min typ max audio output ; audio_en = high audio output voltage v o 3 i o 3 = 200ma 8.1 8.5 8.9 v audio output current i o 3 v o 3 8v 300 a line regulation v oln 3 10v < v cc < 16v, i o 3 = 200ma 30 100 mv load regulation v old 3 1ma < i o 3 < 200ma 70 140 mv dropout voltage v drop 3 i o 3 = 200ma 0.4 0.7 v v cc ripple rejection r rej 3 f = 120hz, v cc =1v pp , i o 3=200ma 40(*2) 50(*2) db swu (3.3v) output ; seu_en = high ilm output voltage v o 4 i o 4 = 400ma 3.13 3.3 3.47 v ilm output current i o 4 v o 4 3.1v 500 ma line regulation v oln 4 7.5v < v cc 1 < 16v, i o 4 = 400ma 30 100 mv load regulation v old 4 1ma < i o 4 < 400ma 80 150 mv v cc 1 ripple rejection r rej 4 f = 120hz, v cc 1=1v pp , i o 4=400ma 40(*2) 50(*2) db *1: the entire specification has been defined based on the te sts performed under the conditions where tj and ta(=25 c) are almost equal. there tests were performed with pulse load to minimize t he increase of junction temperature(tj). *2 : design certification package dimensions unit : mm (typ) 3336 allowable power dissipation derating curve (a) ic unit(hzip15) (b) with al heatsink(50 50 1.5mm 3 ) al heatsink mounting conditions tightening torque: 39n cm, using silicone grease sanyo : hzip15 21.6 (20.0) (14.55) (11.0) (9.05) heat spreader (11.0) (r1.75) (8.6) 3.0 17.9 12.4 3.35 0.7 2.54 2.54 1.27 (1.91) 115 0.4 pd max -- ta 0 7 2 1 4 3 5 6 0 100 125 25 150 1.3 5.3 50 75 8 allowable power dissipation, pd max - w ambient temperature, ta - c ic unit al heat sink (50 50 1.5mm 3 )
LV5683P no.a1982-4/9 pin assignment block diagram + - 8 + 3 300ma + - + - 13 + 1100ma 14 10 + - 15 thermal shut down output control 2 + 500ma + b+ v cc gnd start up vref overvoltage protection audio_en swu_en usb_en 12 + 5 300ma 6 9 v cc 1 + 11 audio(8.5v) v dd (5v/3.3v) ikv dd : v dd (3.3/5.0v) select ikv dd =open or v dd out 5.0v ikv dd =gnd: 3.3v ex.) dc-dc usb/cd(5v/8v) ikusb: usb(5/8v) select ikusb=open or usb out: 8v ikusb=gnd: 5v swu(3.3v) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 (nc) audio_en (nc) (nc) audio v dd ikv dd v cc v cc 1 swu_en ikesb usb_en gnd swu usb LV5683P
LV5683P no.a1982-5/9 pin function pin no. pin name description equivalent circuit 1 n.c. - - 2 audio_en audio output ctrl 8 14 v cc gnd 2 3 audio audio output when audio_en = high, on 8.5v/0.3a 8 14 v cc gnd 3 4 n.c. - - 5 v dd v dd output 5.0v, 3.3v/0.3a 8 14 v cc gnd 5 6 ikv dd v dd output voltage select open : v dd = 5.0v gnd : v dd = 3.3v 8 14 v cc gnd 6 7 n.c. - - 8 v cc v cc 8 14 v cc gnd 9 9 v cc 1 v cc 1 continued on next page.
LV5683P no.a1982-6/9 continued from preceding page. pin no. pin name description equivalent circuit 10 swu_en swu output ctrl 8 14 v cc 1 gnd 10 11 ikusb usb output voltage select open : v dd = 8.0v gnd : v dd = 5.0v 8 14 v cc 1 gnd 11 12 usb_en usb output ctrl 8 14 v cc 1 gnd 12 13 usb usb output when usb_en = high, on 5.0v, 8.0v/1.1a 8 14 v cc 1 gnd 13 14 gnd gnd 15 swu swu output when swu_en = high, on 3.3v/0.5a 8 14 v cc 1 gnd 15
LV5683P no.a1982-7/9 timing chart 21v v cc (8pin) v cc 1 (9pin) v dd (5pin) usb_en (12pin) usb (13pin) audio_en (2pin) audio (3pin) swu_en (10pin) swu (15pin)
LV5683P no.a1982-8/9 hzip15 heat sink attachment heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. unless otherwise specified, for power ics with tabs and pow er ics with attached heat sinks, solder must not be applied to the heat sink or tabs. b. heat sink attachment use flat-head screws to attach heat sinks. use also washer to protect the package. use tightening torques in the ranges 39-59ncm(4-6kgcm) . if tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. take care a position of via hole . do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. verify that there are no press burrs or screw-hole burrs on the heat sink. warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for e ither concave or co nvex warping. twisting must be limited to under 0.05 mm. heat sink and semiconductor device are mounted in parallel. take care of electric or compressed air drivers the speed of these torque wrench es should never exceed 700 rpm, and should typically be about 400 rpm. c. silicone grease spread the silicone grease evenly when mounting heat sinks. sanyo recommends yg-6260 (momentive performance materials japan llc) d. mount first mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. when attaching a heat sink after mounting a semiconducto r device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. when mounting the semiconductor device to the heat sink using jigs, etc., take care not to allow the device to ride onto the jig or positioning dowel. design the jig so that no unreas onable mechanical stress is not app lied to the semiconductor device. f. heat sink screw holes be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. when using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. a hole diameter about 15% larger than the diameter of the screw is desirable. when tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. a diameter about 15% smaller than the diameter of the screw is desirable. g. there is a method to mount the semiconductor device to the heat sink by using a spring band. but this method is not recommended because of possible displ acement due to fluctuation of the spring force with time or vibration. binding head machine screw countersunk head mashine screw heat sink gap via hole
LV5683P ps no.a1982-9/9 this catalog provides information as of october, 2011. specifications and information herein are subject to change without notice. sanyo semiconductor co.,ltd. assumes no responsib ility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all sanyo semiconductor co.,ltd. products described or contained herein. sanyo semiconductor co.,ltd. strives to supply high-quality high-reliab ility pr oducts, however, any and all semiconductor products fail or malfunction with some probab ility. it is possible that these pr obab ilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause dam age to other property. when designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of sanyo semiconductor co.,ltd. or any third party. sanyo semiconductor co.,ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. when designing equip ment, refer to the "delivery specification" for the sanyo semiconductor co.,ltd. product that you intend to use. in the event that any or all sanyo semiconductor co.,ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of sanyo semiconductor co.,ltd.
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